Abstract
Fully Automatic Precision Dicing Saw equipment for 8inch 12inch Wafer Cutting
The fully automatic precision dicing saw is an advanced semiconductor cutting system designed for high-precision separation of wafers (8"/12") and brittle materials. Utilizing diamond blade technology (30,000-60,000 RPM), it achieves micron-level cutting accuracy (±2μm) with minimal chipping (<5μm), outperforming alternative methods in semiconductor and advanced packaging applications. The system integrates high-rigidity spindles, nanometric positioning stages, and intelligent vision alignment for unmanned operation, meeting the stringent requirements of modern chip manufacturing and third-generation semiconductor processing.
Technical parameters
| Parameter | Specification |
| Working Size | Φ8", Φ12" |
| Spindle | Dual-axis 1.2/1.8/2.4/3.0, Max 60000 rpm |
| Blade Size | 2" ~ 3" |
| Y1 / Y2 Axis | Single-step increment: 0.0001 mm |
| Positioning accuracy: < 0.002 mm |
| Cutting range: 310 mm |
| X Axis | Feed speed range: 0.1–600 mm/s |
| Z1 / Z2 Axis | Single-step increment: 0.0001 mm |
| Positioning accuracy: ≤ 0.001 mm |
| θ Axis | Positioning accuracy: ±15" |
| Cleaning Station | Rotation speed: 100–3000 rpm |
| Cleaning method: Auto rinse & spin-dry |
| Operating Voltage | 3-phase 380V 50Hz |
| Dimensions (W×D×H) | 1550×1255×1880 mm |
| Weight | 2100 kg |
Advantages
1. High-speed cassette frame scanning with collision prevention alert system enables rapid precision positioning and superior error correction capability;
2. Innovative dual-spindle synchronous cutting mode increases processing efficiency by 80% compared to single-spindle systems;
3. Premium imported ball screws, linear guides, and Y-axis grating closed-loop control ensure long-term machining stability;
4. Fully automated operation (loading/positioning/cutting/inspection) significantly reduces manual intervention;
5. Unique gantry-style dual-spindle design with minimum 24mm blade spacing accommodates diverse cutting requirements;
Features
1. High-precision non-contact height measurement system;
2. Multi-wafer simultaneous dual-blade cutting capability;
3. Intelligent detection systems (auto-calibration/cut mark inspection/blade breakage monitoring);
4. Multi-mode alignment algorithms adaptable to various process requirements;
5. Real-time position monitoring with automatic error correction;
6. First-cut quality verification mechanism;
7. Customizable factory automation module integration;
Adaptation materials and applications
| Material | Typical Applications | Processing Requirements |
| Aluminum Nitride (AlN) | High-power thermal substrates, LED packaging | Low-stress dicing, delamination prevention |
| PZT Ceramic | 5G filters, SAW devices | High-frequency stability cutting |
| Bismuth Telluride (Bi₂Te₃) | Thermoelectric modules | Low-temperature processing |
| Monocrystalline Silicon (Si) | IC chips | Submicron dicing accuracy |
| Epoxy Molding Compound | BGA substrates | Multilayer material compatibility |
| Cu Pillars/PI Dielectric | WLCSP | Ultra-thin wafer processing |
Machining effect
